发明名称 |
Multilayer circuit board and multichip module substrate. |
摘要 |
Multilayer printed circuit boards and multi-chip modular substrates (I) comprise laminated composite(s) of high temp.-resistant plastic (II) and metallic strip conductors (III), in which the plastic (III) is provided with a thin coating of amorphous, hydrogen-contg. carbon (a-C:H) having a hardness gradient and a water permeation coefft. of less than 1.1 x 10<-13> m<2>/s. Also claimed is a process for the prodn. of (I) by forming a thin layer of a-C:H on the plastic (II) by HF plasma deposition from gaseous hydrocarbons. |
申请公布号 |
EP0683516(A3) |
申请公布日期 |
1996.11.13 |
申请号 |
EP19950106940 |
申请日期 |
1995.05.08 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
HAMMERSCHMIDT, ALBERT, DR.;BIRKLE, SIEGFRIED, DR. |
分类号 |
C08J7/00;C23C16/26;C23C16/50;H01L23/12;H01L23/14;H05K1/03;H05K3/38;H05K3/46;(IPC1-7):H01L23/14 |
主分类号 |
C08J7/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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