发明名称 |
Method of making an array of electrical components with leads attached and the product thereof |
摘要 |
A method of making an array of electrical components having pre-attached leads ready for automated surface-mounting on a substrate. The method involves aligning an array of leads with electrical components and attaching each lead to a conductive terminal on a respective component. A series or coil of leads joined integrally together and carried by a carrier strip is thus provided with a series of electrical components pre-attached thereto. The electrical components along with their leads may thus be quickly and easily surface-connected to the conductive pads on a substrate in a simple, automated manner. |
申请公布号 |
US5571034(A) |
申请公布日期 |
1996.11.05 |
申请号 |
US19950375970 |
申请日期 |
1995.01.20 |
申请人 |
NORTH AMERICAN SPECIALTIES CORPORATION |
发明人 |
SEIDLER, JACK |
分类号 |
H01L23/495;H01R4/02;H01R12/04;H01R43/02;H01R43/16;H01R43/20;H05K13/00;(IPC1-7):H01R4/02 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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