| 摘要 |
PURPOSE: To provide a copper clad laminate, the etching factor of which is high and in which fine pattern can be produced. CONSTITUTION: The copper clad laminate is produced by bonding copper foil 1, the roughness of the roughened surface of which is Ra=0.8μm or less, preferably 0.7μm or less, especially preferably 0.6μm or less after roughening treatment, to at least one side of board 2. By roughening the surface to Ra=0.8μm or less, copper particles 10 become hard to leave at the foot of etching pattern, resulting in allowing to produce fine pattern.
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