发明名称 ELECTRONIC COMPONENT SUPPLYING APPARATUS
摘要 PURPOSE: To provide an electronic component supplying apparatus in which the component can be stably conveyed to the component taking-out position by eliminating the drop of the component from the conveying surface of an embossed carrier tape. CONSTITUTION: An apparatus for supplying an electronic component 18 to a predetermined chip type component taking-out position 11 by incorporating the component in the embossed mounting holes 17 arranged at equal intervals and conveying an embossed carrier tape 15 wound in a containing reel sealed by a top cover tape at a constant pitch has a recessed guide 16 matched to the holes 17 of the tape 15 near the position 11.
申请公布号 JPH08288690(A) 申请公布日期 1996.11.01
申请号 JP19950112489 申请日期 1995.04.13
申请人 SONY CORP 发明人 MIYATA HITOSHI;TANAKA SATORU;KUMETA YOSHIYUKI
分类号 B23P19/00;H05K13/02 主分类号 B23P19/00
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