| 摘要 |
<p>PURPOSE: To obtain a thin type IC card which is strong in bending stress by a method wherein a reinforcing sheet is arranged along an outer peripheral fringe of an IC chip on a fitting face side of the IC chip to a film substrate in the IC chip in which an IC module of fitting the IC chip to the film substrate is buried. CONSTITUTION: When an IC module wherein electronic parts of an IC chip in which a memory or the like is built-in are mounted on a lower surface side of a film substrate 4, a tip part inner lead 3a of a lead 3 provided on the substrate 4 is projected in an opening part 4a in which the IC chip 1 is packed, opened in the substrate 4, and its tip part is connected to a bonding bump electrode 2 by thermocompression bonding. Then, a reinforcing plate 6 having an opening part 6a larger than the opening part 4a is fixed to an IC chip 1 fitting face side of the substrate 4 by lining on a surface of the substrate 4 with an adhesive 5 along the outer peripheral fringe of the IC chip 1. Thereby, breakage of the IC module when bending stress is applied is prevented.</p> |
