| 摘要 |
PURPOSE: To provide conductive paste turning to a via-electrode in an excellent state of high reliability which is suitable to a glass ceramic multilayered substrate of high precision without generating contraction in the plane direction. CONSTITUTION: Inorganic component as the mixture of 32.0-56.0vol% oxide copper, 8.0-14.0vol% copper, and 30.0-60.0vol% glass as inorganic binder is dispersed in solvent and organic binder. Preferably, the average grain diameter of copper particles is at least 3.0μm, that of copper oxide is 1.0-7.0μm, and that of glass as the inorganic binder is 1.0-5.0μm. The sintering of copper at the time of baking is delayed, the sintering of an electrode is restrained until the sintering of a glass ceramic substrate, and then the sintering is started. By setting the compounding amount of copper to 8.0-14.0vol%, and setting the average grain diameter of copper to at least 3.0μm, substrate breakdown due to volume expansion can be prevented when the copper oxidized at the time of debinder elimination performed in oxygen.
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