| 摘要 |
PURPOSE: To provide a soldering jig to obtain a substrate for mounting electronic parts having high precision and high reliability and a manufacturing method for such substrate for mounting. CONSTITUTION: In a soldering step for soldering a base part 31 of a lead pin 3 for external connection to a substrate body 2 by permitting molten solder to enter from the underside of the substrate body 2 into each through hole 23 of the substrate body 2, of each process of manufacturing the substrate body 2 equipped with a recess 25 for mounting electronic parts on its underside and manufacturing a substrate for mounting electronic parts equipped with a lead pin 3 for external connection, there is disposed at the underside of the substrate body 2 a jig which is equipped with a protrusion 12 for concealing which is slidably fitted into the recess 25 for mounting the electronic parts. Also, another soldering jig designed to make it difficult for a solder bridge to occur in soldering on a feeder conductor pattern which is formed at the underside of the substrate body. |
