| 摘要 |
<p>PURPOSE: To provide a method of fabricating an elastic surface wave apparatus which does not allow corrosion of an electrode material in the case of dividing a piezoelectric substrate on which a plurality of elastic surface wave elements are formed en bloc into individual chips. CONSTITUTION: In a fabrication method of elastic surface wave apparatus comprising a process to form a plurality of elastic surface wave apparatuses on a piezoelectric substrate and a process to divide the piezoelectric substrate into chips, a specific resistance value used in the dividing process is set to a value less than 0.1 (more preferably 0.04) MΩ.cm (not including 0). Moreover, amount of dissolved oxygen used in the dividing process is set to a value less than 1.9 (preferably 1.5) ppm (not including 0). Moreover, specific resistance value of water used in the dividing process is set to a value less than 0.1 (preferably 0.04) MΩ.cm (not including 0).</p> |
