PROCESS FOR SURFACE CONTACTING ELECTRONIC COMPONENTS

摘要

A process for connecting an electronic component (10) having contact surfaces (12) with a substrate (11) having a contact surfaces (14) via contact metallizations (16, 17) between the contact surfaces of connecting material (15) made by a soldering or welding process, in which the electronic component and the substrate are pressed together with the application of heat, whereby during the connecting process an application layer (18) of a medium (19) containing a polyalcohol is inserted at least between the contact surfaces (12) of the electronic component (10) or the substrate (11) and the connecting material (15).