| 摘要 |
PURPOSE: To electrically connect two or more layers to each other by a method, wherein there is formed a second insulation layer having a second via hole located directly above a first via hole, so as to come into contact with a first insulation layer. CONSTITUTION: A plating layer 330 made of a conductive layer is made in a first via hole 340, formed in a first insulation layer 310 on a board 300, and thereafter the first via hole 340 is filled with a metal, a metal paste, resin, etc. This filled surface is smoothed and another second insulation layer 320 is formed thereon, and in the second insulation layer 320, a second via hole 350 is formed substantially directly above the filled first via hole 340, and a plating layer 360 is formed on the second via hole 350. Thereby, two or more insulation layers 310, 320 can be connected electrically to each other. |
