| 摘要 |
PURPOSE: To reduce the lead impedance of power supply system and ground system between the electrode on a mounted IC chip and the tip of an outer lead as compared with conventional one. CONSTITUTION: Inner leads 5a, 5b, outer leads 6a, 6b and an island 4 are formed in conductor pattern on one surface of a flexible insulating board 1 having the other surface covered entirely, including an outer lead group but excepting a part of corner part, with one solid conductive layer pattern 2. The island 4, the solid conductive layer pattern 2 and the tip part of the outer lead 6b are connected through a through hole 8c and the ground potential supply electrode of a semiconductor chip 3 face-down mounted on the island is wire bonded to the island 4 through shortest route thus forming the current path of the ground system. Since the solid conductive layer pattern 2 having wide area is inserted farther than the island, the lead impedance is decreased as compared with conventional one the decreasing the impedance of resin sealed semiconductor device. |
