LEAD FRAME STRUCTURE OF SEMICONDUCTOR PACKAGE

摘要

PROBLEM TO BE SOLVED: To prevent the interface separating phenomenon generated from an adhering part with a semiconductor chip adhered to a chip mounting plate by reducing the area of the chip mounting plate compared with the area of a face on a semiconductor chip adhering side and providing a connecting part between tie-bars and the chip mounting plate. SOLUTION: This system is provided with a lead 8 positioned at a peripheral part, a chip mounting plate 3 adhered with a semiconductor chip C and tie-bars T1 to T4 supporting this plate 3. The chip C is mounted by adhering to a part of the plate 3 and a connecting part 4 connected to its outside with the plate 3 in a center by epoxy resin. The area of the plate 3 is particularly reduced compared with the area of the face on the adhering side of the semiconductor chip C. In addition a part 4 is provided between the tie-bars T1 to T4 and the chip mounting plate 3. Thereby the deformation of the plate 3 by thermal expansion is reduced to prevent interface separation between the plate 3 and the chip C.