发明名称 Integrierte Schaltungspackung mit eingekapselter Batteriezelle
摘要 An integrated circuit package (10) encapsulates a volatile memory chip (12) and a backup battery (34) for preserving data in the event of loss of main power supply. The package includes a lead frame (20) assembly encapsulated within a body (32) of non-conductive material, with the memory chip being mounted onto a base plate (22) on one side of the lead frame. The battery is supported in offset relation by axial power leads on the opposite side of the lead frame. The integrated circuit chip, the battery, the lead frame assembly and the gold interconnect wires (36) are completely encapsulated within the molded package body. <IMAGE>
申请公布号 DE69119042(T2) 申请公布日期 1996.08.29
申请号 DE1991619042T 申请日期 1991.11.18
申请人 SGS-THOMSON MICROELECTRONICS, INC. (N.D.GES.DES STAATES DELAWARE), CARROLLTON, TEX., US 发明人 HUNDT, MICHAEL J., DENTON COUNTY, TEXAS 75067, US;KELAPPAN, KRISHNAN, CARROLLTON, DALLAS 75006, US
分类号 H01L23/50;G11C5/14;H01L23/495;H01L25/00;(IPC1-7):H01L23/58 主分类号 H01L23/50
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