发明名称 |
Manufacturing method for multilayer ceramic substrate |
摘要 |
A manufacturing method for a multilayer ceramic substrate superior in adhesion between the substrate and thick film pads formed on the surface of the substrate. Copper paste is screen-printed on a glass-ceramics green sheet for forming a surface layer to form a plurality of surface thick film pads respectively connected to a plurality of vias formed in the green sheet. Each of the surface thick film pads is partially covered with a dielectric material. Then, a plurality of green sheets for forming inner layers and the surface-layer green sheet are laminated together so that the surface-layer green sheet forms an uppermost layer. The laminated sheets are bonded integrally with each other by applying heat and pressure, and are then fired at a predetermined temperature for a predetermined time.
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申请公布号 |
US5549778(A) |
申请公布日期 |
1996.08.27 |
申请号 |
US19950519178 |
申请日期 |
1995.08.25 |
申请人 |
FUJITSU LIMITED |
发明人 |
YOKOYAMA, HIROMITSU;TAKEUCHI, KATSUTO;SOEKAWA, KOJI;ABE, KENICHIRO;HATTORI, SYOUICHI;SUZUKI, HITOSHI;OKADA, NOBUHIDE |
分类号 |
H05K3/40;H05K3/46;(IPC1-7):B32B31/00 |
主分类号 |
H05K3/40 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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