| 摘要 |
PURPOSE:To obtain a semiconductor device capable of increasing the effective area for wire bonding without changing a resin molding member by making lead arrangement asymmetric, biasing central leads on one side, forming widely a post part of the lead on the other side in a hook type, and wire-bonding many wires. CONSTITUTION:A central drain lead 11 is bent into a hook shape, and biased on the left side. Three wires 4 are bonded to the lead 8 wherein a source post 12 is extended in the left vacant space. The post area extended in this manner is 1.5-2.0 times as compared with the conventional one, and the effective area wherein the area like a bonder-presser part is eliminated becomes 3-5 times, so that this area can sufficiently correspond with multiwires. |
