发明名称 POLISHING APPARATUS
摘要 <p>PURPOSE: To provide a polishing apparatus which can finish the whole surface of an object to be polished into a highly flattened surface. CONSTITUTION: The polishing apparatus is featured in that the apparatus has a turn table 1 whose upper surface is covered with polishing cloth 3 and a top ring 4, where these turn table 1 and the ring 4 turn with different speed respectively, and an object 5 to be polished is held therebetween so that the surface of the object can be polished into a flat and mirror-like surface. Then, a plurality of nozzles 10A, 10B... 10G are arranged above the table 1 and abrasive solutions with different concentrations are supplied on the polishing cloth 3 spread on the turn table 1.</p>
申请公布号 JPH08197427(A) 申请公布日期 1996.08.06
申请号 JP19950027630 申请日期 1995.01.24
申请人 EBARA CORP;TOSHIBA CORP 发明人 KIMURA NORIO;ISHII YU;YASUDA HOZUMI;SAITO KOJI;KODERA MASAKO;MISHIMA SHIRO
分类号 B24B37/00;B24B57/02;(IPC1-7):B24B57/02 主分类号 B24B37/00
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