| 摘要 |
<p>Electrical feedthroughs in printed circuit board support substrates (24) for use in making double sided ceramic multilayer printed circuit boards are made by insulating the feedthrough openings with a first layer of nickel oxide (22) and one or more layers of glass (26, 28), and then filling the remainder of the feedthroughs with a conductive metal via fill ink (30). After firing, the resultant structure provides insulated electrical feedthroughs through the support substrate (24).</p> |
