| 摘要 |
A multi-layered printed wiring board 500 for high frequency application includes a first board 100 of polytetrafluoroethylene (PTFE) having a metallic sheet on each side. The first side 10 is etched to form high frequency circuity using micro-strip technology and the second side 30 being a metallic sheet forming the ground plane. Laminated to the ground plane of the first board is a fiberglass board 200 of thickness, A; laminated to the fibreglass board is a second board 300 of fibreglass having a thickness, A. The second board also has metallic sheets on both side, the side being laminated to the fiberglass board being etched to form stips 50, prior to being laminated, forming signal and transmission lines utilizing strip-line technology. Vias are formed to interconnect predetermined metallic layers. |
