发明名称 |
LAMINATING METHOD FOR DRY RESIST FILM |
摘要 |
<p>PURPOSE: To improve the mounting state of a thick resist film and to prevent fuzzing of a resist layer after peeling of a base film by cooling a base plate to which the dry resist film is thermally contact-bonded and cutting the resist film on the base plate and thereafter reheating it and removing the projected film. CONSTITUTION: A dry resist film 1 is thermally contact-bonded together with a base plate 2 by heated laminate rollers 5, 6 and sent to the cooling part of the base plate by conveyance rollers 4 and cooled by the cooling means 7 of the base plate. The cooled base plate 2 is sent to the cutting part of a film on the base plate and the dry resin film 1 connecting the mutual base plates 2 is cut on the respective base plates 2. The base plate 2 to which the dry resist film 1 is bonded is sent to a film-removing part and reheated by heating rolls 18. The dry resist film 1 is removed from the reheated base plate 2 by a film peeling means 14.</p> |
申请公布号 |
JPH08183146(A) |
申请公布日期 |
1996.07.16 |
申请号 |
JP19940328773 |
申请日期 |
1994.12.28 |
申请人 |
SHARP CORP |
发明人 |
MORIMOTO MITSUAKI;OKITA TAKASHI;IWAMOTO TAKASHI;INUKAI HIDEYUKI |
分类号 |
G03F7/16;B32B37/00;B32B37/22;(IPC1-7):B32B31/10;B32B31/18 |
主分类号 |
G03F7/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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