发明名称 CLAMPLESS VACUUM HEAT TRANSFER STATION
摘要 A clampless heat exchange station for a semiconductor wafer (5) for use in a vacuum chamber, at pressures from 2 Torr to 30 Torr using commercial grade inert gas. The heat exchange chuck (1) has apertures (2) therethrough in the region where the wafer (1) is to be mounted to serve as a miniature gas plenum to provide equal pressure along the bottom and top sides of the wafer (1). This configuration avoids chipping and particle deposition, and provides improved heat transfer rate and wafer temperature uniformity.
申请公布号 WO9621244(A1) 申请公布日期 1996.07.11
申请号 WO1996US00525 申请日期 1996.01.04
申请人 VARIAN ASSOCIATES, INC. 发明人 BOYD, TRACE, LEE
分类号 H01L21/677;H01L21/00;H01L21/205;H01L21/22;H01L21/265;(IPC1-7):H01L21/68;F28F13/00;F28F23/00 主分类号 H01L21/677
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