发明名称 |
APPARATUS AND METHOD FOR DICING SEMICONDUCTOR WAFERS |
摘要 |
<p>A wafer to be diced to form chips is placed on the sticky side of a thin elastic film in the form of a Swiss Cross which is secured to the side members of a compressed but expandable square frame, the frame being placed in a scribing and dicing machine in its released state so that the frame and thus the film can expand during the dicing operation, further expansion being accomplished after dicing of the wafer by heating the film while in an expansion fixture to insure removal of the chips from the film without damaging adjacent chips. The sticky material on the film may be rendered less sticky after formation of the chips by exposure to ultraviolet energy or the like.</p> |
申请公布号 |
EP0720521(A1) |
申请公布日期 |
1996.07.10 |
申请号 |
EP19950929429 |
申请日期 |
1995.07.20 |
申请人 |
LOOMIS INDUSTRIES, INC. |
发明人 |
LOOMIS, JAMES, W.;TWEEDIE, RICHARD, T. |
分类号 |
H01L21/301;B28D5/00;H01L21/00;H01L21/687;(IPC1-7):B25B27/00 |
主分类号 |
H01L21/301 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|