发明名称 METHOD AND DEVICE FOR ARRANGING EXTERNAL CONNECTION TERMINAL
摘要 <p>PURPOSE: To surely suck one external connection terminal to one opening of the suction holes provided on a suction board by combining the suction board with a guide board whereupon the guide holes are provided, so as to permit the opening of each suction hole of the suction board to accord with the guide hole which permits only one solder ball to pass through. CONSTITUTION: A device for arranging external connection terminals is separated into a top side part 10 and the bottom side part 50. For the bottom side part 50 that combines with the top side part 10, a resin guide board 56, which is provided with guide holes 52, 52... that permit only one solder ball to pass through and alignment holes 54 and 54 that permit the guide pins 20 of the top side part 10 to penetrate, is fit movably in a casing 58 at the positions that correspond to each suction hole 12 formed on a suction board 14. The part whereupon the guide holes 52, 52... are provided is formed protrusively, so as to allow easy adhesion to the suction board 14 at the parts whereupon the suction holes 12 and 12 are provided.</p>
申请公布号 JPH08167611(A) 申请公布日期 1996.06.25
申请号 JP19940311564 申请日期 1994.12.15
申请人 SHINKO ELECTRIC IND CO LTD 发明人 TOKIDA MASAKUNI
分类号 H01L23/12;H01L21/60;H05K3/34;(IPC1-7):H01L21/321 主分类号 H01L23/12
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