发明名称 CONDUCTIVE COMPOSITION
摘要 PURPOSE: To provide a conductive composition for forming a conductive resin layer with high conductivity without deteriorating the physical and chemical characteristics of a binder resin by lessening conductive particle density contained in the binder resin. CONSTITUTION: A conductive composition contains at least conductive particles whose mean particle diameters are 1.0μm or more and 0.1μm or less. The mixing ratio of the conductive particles of 1.0μm or more and of 0.1μm or less is 10:1 to 10:5.
申请公布号 JPH08167320(A) 申请公布日期 1996.06.25
申请号 JP19940332572 申请日期 1994.12.13
申请人 PENTEL KK 发明人 NAKAYAMA TSURUO;OZAWA KINICHI;WAKE HITOSHI;KODAMA HIDETOSHI;SHIGEMORI MASAKI
分类号 C09D5/24;H01B1/00;H01B1/20;H05K1/09;(IPC1-7):H01B1/00 主分类号 C09D5/24
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