发明名称 FORMING METHOD OF SOLID CIRCUIT
摘要 PURPOSE: To uniformly form circuits on the surface of a solid board, by adjusting laser light irradiation in the manner in which the laser light energy absorbed by each surface of a solid of the surface of a solid board becomes almost uniform, and irradiating the surface of the solid board with the laser light. CONSTITUTION: Energy of leaser light L absorbed by the vertical surface part 4b and the slant surface part 4a of a solid board 1 is made almost uniform. As a means for changing the energy density of the laser light L which which the vertical surface part 4b and the slant surface part 4a are irradiated, a glass mask 10 composed of synthetic quartz wherein the transmittance to the laser light L is changed according to irradiation positions is used. That is, out of the mask 10, a transmission part 15a for transmitting the laser light with which the slant surface part 4a is irradiated is formed so as to transmit 100% of the laser light L. A part 15b for transmitting the laser light with which the vertical surface part 4b is irradiated is formed so as to transmit 50% of the laser light L.
申请公布号 JPH08148803(A) 申请公布日期 1996.06.07
申请号 JP19940285631 申请日期 1994.11.18
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 OKAMOTO TAKESHI;OOTANI RIYUUJI;MUTO MASAHIDE
分类号 B23K26/00;B23K26/06;B23K26/067;B23K26/18;H05K3/00;H05K3/06;H05K3/08;H05K3/18 主分类号 B23K26/00
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