Mfg. circuit board based on core plate of aluminium or alloy
摘要
On the core plate (1) an Al203 coating (2) is formed by anodic oxidn. with a blocking layer (3) and conc. in e.g. water at 98 deg.C to produce a compressed oxide layer (4). A photolithographic mask is applied leaving particular areas (6,7) free for conductive tracks. These areas are roughened in prepn. for submersion in acetate soln. from which a Pd nucleation layer is deposited for Ni plating. The tracks (11,12) remain after removal of the mask with the Pd and Ni from the masked area (10).
申请公布号
DE4444567(A1)
申请公布日期
1996.06.05
申请号
DE19944444567
申请日期
1994.12.02
申请人
SIEMENS AG, 80333 MUENCHEN, DE
发明人
REITER, MARTINA, DIPL.-ING., 13437 BERLIN, DE;BEYER, WOLFGANG, DIPL.-ING., 12159 BERLIN, DE;VOGELAERE, MARC DE, DIPL.-CHEM., 13627 BERLIN, DE;MEHLHORN, TORSTEN, DIPL.-ING., 14055 BERLIN, DE
