| 摘要 |
PURPOSE: To enable conductive paste to be filled enough into a through-hole without bleeding by a method wherein conductive paste is filled into the through- holes through a screen printing process which is carried out twice or more on the same surface of a printed wiring board, and the screen printing processes are carried out for filling with different screens. CONSTITUTION: A first screen 10 provided with an opening 13 of diameter D1 corresponding to the position of a through-hole 4 is arranged on a first wiring layer 5 formed on a printed wiring board, conductive paste 12 is provided to the surface 10a of the first screen 10, and a first squeegee 14 is made to travel on the surface 10a to sweep away the conductive paste 12, whereby a first filling printing process is carried out to extrude conductive paste 12 through the first screen. Then, a second screen 11 provided with an opening 17 of diameter D2 corresponding to the position of the through-hole 4 is arranged on the first wiring layer 5 of the printed wiring board, conductive paste 12 is provided onto the surface 11a of a second screen 11, and a second squeegee 15 is made to travel on the surface 11a of the second screen 11 in the same direction with the first squeegee to carry out a second filling printing process through the second screen 11. |
