| 摘要 |
In encapsulating an optocomponent a leadframe (51) is used for the electrical connection of the component, the leadframe having a flag (53), to which the main body of the optocomponent is attached. The flag (53) is located asymmetrically at an outer edge of the leadframe and is, in the encapsulating operation, placed close to a sidewall in a mould cavity in a mould. Thereby an optical interface of standard type can be obtained in the wall of the capsule. Further, the flag (53) is flexibly attached, by means of zigzag-shaped bridges (67), to other portions of the leadframe so that the flag and thus the optocomponent will have a possibility to be resiliently and flexibly displaced a little at the positioning thereof in the mould cavity in the mould in relation to the other portions of the leadframe, in particular to its outer frame portions (61) and bridge portions (59). By designing the zigzag-shaped bridges (67) with a suitably adapted width and thickness a controlled elastic restoring force acting on the flag (53) can be obtaied and thus on the optocomponent, so that it can be pressed and firmly retained in engagement with positioning means for the optocomponent.
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