| 摘要 |
A semiconductor package device capable of reducing inductance as well as improving device mounting density by down-sizing a volume of the package device. The semiconductor package device includes: a lead having an inner lead connected to a ground portion where an end point of the lead coincides with a side face of a resin mold frame and there is provided a concave portion in the lead so that a ground-end lead is exposed; and the resin mold frame which encloses the semiconductor chip and the inner lead. Thereby, the lead is not extended externally of the mold frame, thus making the device further compact-sized. The concave shape is exposed so as to be smoothly and securely interconnected, through a contact window, to bump portions on a mounting substrate.
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