| 发明名称 |
Method for reducing metal contamination of silicon wafers during semiconductor manufacturing |
| 摘要 |
A complex building agent, such as EDTA is added in a predetermined concentration to the "SC 1" step of a "PIRANHA-RCA" cleaning sequence for reducing the metal contamination left on the surface of a silicon wafer after completion of this cleaning step. <MATH> |
| 申请公布号 |
EP0690482(A3) |
申请公布日期 |
1996.04.17 |
| 申请号 |
EP19950107945 |
申请日期 |
1995.05.23 |
| 申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
SCHULZ, PETER |
| 分类号 |
C11D7/60;H01L21/02;H01L21/304;H01L21/306;H01L21/3213 |
主分类号 |
C11D7/60 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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