| 摘要 |
PURPOSE: To provide a device having an electronic device mounted therein, having high reliability of electrical connection and satisfactory electrical property of the package. CONSTITUTION: An electronic device is composed of a wiring board 1 having a conductive pattern 11 formed on the surface thereof and having an electronic component housing through-hole 12 formed therein, a metallic radiation plate 5 fixed on one surface of the wiring board with an adhesive, an electronic component 2 mounted on the radiation plate 5, plural lead frames 4 connected with one end of the conductive pattern electrically connected with the electronic component, and a mold resin encapsulation portion 8 for encapsulating the electronic component. A through-hole 51a is formed in the metallic radiation plate 5, and a solder 7 is provided in the through-hole 51a. The conductive pattern 11 on the wiring board and the metallic radiation plate 5 are electrically connected with each other by the solder. |
