Outer-lead bonding apparatus and method therefor

摘要

An outer lead bonding apparatus and method bonds an outer lead of a tape carrier package to an electrode formed on a display panel. During the observation stage when positional deviations between the outer lead and electrode are detected and corrected, a pressing member presses on the outer lead to remove any warp or bend in the outer lead. The electrode includes anisotropic conductive tape which is inherently adhesive. To prevent unwanted movement of the tape carrier package during the observation and positioning process by premature sticking of the outer lead to the tape on the electrode, the tape carrier package is sandwiched firmly in place.