发明名称 MATERIAL FOR MANUFACTURING ELECTRICAL CONDUCTIVITY CONNECTION IN THERMOPLASTIC MOLDING
摘要 PROBLEM TO BE SOLVED: To carry out injection molding of a conductive pattern together with a housing, which requiring post-treatment of the conductive pattern by adding a specified conductive fiber to a thermoplastic resin. SOLUTION: A material with 1Ω.cm or less of volume resistivity for producing conductive connection is produced by blending 0.5-30 vol.% of a conductive fiber with 5-20 mm length and 5-100μm diameter and 0-50 vol.% of a non- conductive filler with 0.5 mm or shorter length to a thermoplastic resin. Consequently, the material is provided with a sufficiently high conductivity and mechanical toughness and can be worked thermoplastically.
申请公布号 JPH0864030(A) 申请公布日期 1996.03.08
申请号 JP19950202001 申请日期 1995.08.08
申请人 HOECHST AG 发明人 BERUNHARUTO PUFUAIFUAA
分类号 H01R11/01;C08K7/02;H01B1/00;H01B1/20;H01B1/22;H01B1/24;H05K1/09;H05K3/32;(IPC1-7):H01B1/20 主分类号 H01R11/01
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