METHOD FOR SEALING ELECTRONIC PART IN RESIN

摘要

PURPOSE: To enable a silicon hardened material with relatively few number of gas holes and good appearance to be resin sealed by heating to a specific temperature a material composed of silicon of the additional reaction hardening type whose induction time and a time to become a specified degree of vulcanization in vulcanization temperature satisfy a specific formula. CONSTITUTION: A material composed of silicon of the additional reaction hardening type is a material whose change of viscosity in 24 hours from immediately after preparation at 25 deg.C is under 20%. Further, the induction time at 120 deg.C obtained by a vulcanization tester is under 200 seconds. The material composed or silicon or the additional reaction hardening type, whose induction time T1 and a time t2 to reach a 90% degree of vulcanization at a vulcanization temperature T deg.C satisfy a formula, is heated to 100 to 200 deg.C and an electronic part is sealed in resin. T in the formula is within a range from 100 to 200 deg.C.