发明名称 EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR SEALING AND SEMICONDUCTOR DEVICE
摘要 PURPOSE: To obtain the subject composition excellent in fluidity in molding and crack resistance and useful for cured material by blending a composition consisting essentially of an epoxy resin, a curing agent and an inorganic filler with a specific silanol-containing silicon compound. CONSTITUTION: This resin composition is obtained by blending an epoxy resin composition containing (A) an epoxy resin (preferably an epoxy resin of formula I), (B) a curing agent (preferably a phenol novolak resin) and (C) an inorganic filler (preferably crushed or globular fused silica having 5-40μm average particle diameter) with (D) a silanol group-containing silicon compound of formula II [R is a monovalent hydrocarbon; (n) is 1 or 2] (especially preferably 1,1,3,3- tetramethyl-1,3-dihydroxydisiloxane) in an amount of 0.05-0.3wt.% based on total amount of the composition.
申请公布号 JPH0859963(A) 申请公布日期 1996.03.05
申请号 JP19940221101 申请日期 1994.08.23
申请人 SHIN ETSU CHEM CO LTD 发明人 FUTATSUMORI KOJI;JINGU SHINICHI;TOTSUKA KENICHI
分类号 C08K9/06;C08L63/00;H01L23/29;H01L23/31;(IPC1-7):C08L63/00 主分类号 C08K9/06
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