Arrangement for substrate deposition or sputtering

摘要

The casing (2) contains the substrate (1), the sputtering, or deposition equipment (3) and the radiation source (4) that sends the pencil of rays (11) through the substrate (1) and deposition layer (10) to the detector (5), which generates a signal indicating the thickness of the layer (10). The photomultiplier (6), amplifier (7), discriminator (8) and counting assembly (9) transmit the signal to a computer and control system (12) which regulate the deposition or sputtering process. Various configurations using multiple radiation sources (5) and detection equipment (6,7,8,9) may be used for the measurement of the film thickness and the process may be controlled by established, fuzzy-logic methods.