| 摘要 |
A conductive via structure establishes an electrical interconnection between two conductive layers in a semiconductor structure by connecting a first conductive layer on a semiconductor substrate to a second conductive layer by means of a conductive via structure extending through a non-conductive layer separating the two conductive layers. The non-conductive layer preferably includes a layer of spin-on-glass (SOG), and is provided with a via aperture therethrough. A conductive spacer, preferably of TiW, is fabricated within the via aperture in abutment with the walls of the via aperture. A second conductive layer is fabricated over the non-conductive layer, the conductive spacer, and within the via aperture, to establish the completed electrical interconnection. The via structure reduces out-gassing and chipping from the SOG layer, yet provides a low electrical resistance path between the two conductive layers.
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