发明名称 METAL PLATING MASK PATTERN
摘要 <p>PURPOSE:To form in uniform film thickness a metal plating mask pattern used as a light shielding layer at the time of exposing a resist layer in a resist pattern forming stage. CONSTITUTION:A dummy pattern part 14 consisting of a metal plating part 15 and a non-plating part 16 are provided at a periphery of a working-effective pattern part 10 in which a pattern corresponding to a resist pattern is formed by metal plating. A dimensional change of the pattern is prevented, and a high precision metal plating mask pattern is obtained even if a substrate has large area. A high precision fine pattern can be formed efficiently by patterning a photo resist layer by using such a metal plating mask pattern.</p>
申请公布号 JPH0844037(A) 申请公布日期 1996.02.16
申请号 JP19940181680 申请日期 1994.08.02
申请人 G T C:KK 发明人 ASAKA KENJI;KUBOZONO KENICHI;UMEDA KAZUO
分类号 C25D5/02;G03F1/00;G03F1/68;(IPC1-7):G03F1/08 主分类号 C25D5/02
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