发明名称 |
METAL PLATING MASK PATTERN |
摘要 |
<p>PURPOSE:To form in uniform film thickness a metal plating mask pattern used as a light shielding layer at the time of exposing a resist layer in a resist pattern forming stage. CONSTITUTION:A dummy pattern part 14 consisting of a metal plating part 15 and a non-plating part 16 are provided at a periphery of a working-effective pattern part 10 in which a pattern corresponding to a resist pattern is formed by metal plating. A dimensional change of the pattern is prevented, and a high precision metal plating mask pattern is obtained even if a substrate has large area. A high precision fine pattern can be formed efficiently by patterning a photo resist layer by using such a metal plating mask pattern.</p> |
申请公布号 |
JPH0844037(A) |
申请公布日期 |
1996.02.16 |
申请号 |
JP19940181680 |
申请日期 |
1994.08.02 |
申请人 |
G T C:KK |
发明人 |
ASAKA KENJI;KUBOZONO KENICHI;UMEDA KAZUO |
分类号 |
C25D5/02;G03F1/00;G03F1/68;(IPC1-7):G03F1/08 |
主分类号 |
C25D5/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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