| 摘要 |
<p>PURPOSE: To provide a method for cutting a semiconductor wafer including a test pattern on a scribe line without causing any sliver. CONSTITUTION: The method cuts a plate wafer, especially semiconductor wafer 30, while removing material 32 deposited along the scribe line. The deposited material generally has a width wider than that of a saw blade 33. The method comprises a step of performing first scribing-cutting on one side of the scribe line, a step of performing second scribing-cutting on the other side of the scribe line, and a step of performing separation cutting along the scribe line for dicing the wafer.</p> |
