发明名称 Drucksensor und Verfahren zu seinem Zusammenbau
摘要 A pressure sensor assembly is provided containing a substrate (116) having signal conditioning circuitry (110,126,130) disposed on both surfaces (134,136) of the substrate (116), with the critical pressure sensing element (140) disposed on one surface (134) of the substrate (116) and the laser trimmable resistors (120) disposed on the other surface (136) of the substrate (116). A ported housing (118) seals the one side (134) of the substrate (116) containing the pressure sensing element (140), thereby forming a pressurizable chamber while having the signal conditioning circuitry (126,130) and resistors (120) on the other surface (136) exposed for calibration by laser trimming of the resistors (120). This eliminates the requirement for a separate housing for the critical pressure sensing element (140). In addition, when the ported housing (118) is mounted to the pressure sensing side (134) of the substrate (116) for formation of the sealed pressure chamber, the through-holes (122) which electrically interconnect the signal processing circuitry (110,126,130) on both sides (134,136) of the substrate (116) are also concurrently sealed. <IMAGE>
申请公布号 DE69207358(D1) 申请公布日期 1996.02.15
申请号 DE1992607358 申请日期 1992.10.09
申请人 DELCO ELECTRONICS CORP., KOKOMO, IND., US 发明人 MATLY, JOHN MICHAEL, KOKOMO, IN 46902, US;DAWSON, JANET SOONG, EAST KOKOMO, IN 46902, US
分类号 G01L9/04;G01L9/00;(IPC1-7):G01L9/00 主分类号 G01L9/04
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