Procédé d'encapsulation de composants ou de modules électroniques et composants ou modules électroniques encapsulés par ledit procédé.

摘要

Method for the encapsulation of electronic components or an electronic unit fitted on a support such as a printed circuit board, consisting in depositing on the components or electronic unit at least two organic layers (15', 18'). The invention is characterized in that a polyurethane-based material, especially a hydroxylateed polyurethane polybutadiene, is selected to form one of the two layers (15').