| 摘要 |
<p>PURPOSE:To obtain a bonder and a board pressing/securing mechanism for enhancing the operation and productivity by pressing and securing a board positively even if the bonding part thereof is made fine in order to manufacture a multi-pin semiconductor device. CONSTITUTION:A press member 176, abutting against a board L/F and pressing the board, is mounted so that it can incline against a plane including the approaching/separating direction onto a mechanism 101 for supporting only the press member or any one of the press member or a bonding stage 255 such that they can approach or be separated from each other. Consequently, the press member copies the surface of the bonding stage automatically and comes into tight contact with the board.</p> |
