| 摘要 |
<p>PURPOSE:To obtain a multilayer wiring board incorporating a capacitor part having a dielectric layer containing a lead based perovskite compound in which the permittivity of dielectric layer is prevented from lowering at the time of firing by interposing a buffer layer between the capacitor part and each glass ceramic composite board. CONSTITUTION:A dielectric layer 2 is sandwiched by electrode layers 31, 32 to constitute a capacitor part which is sandwiched by glass ceramic composite boards 41, 42. The glass ceramic composite boards 41, 42 are provided, on the outer surface with terminal electrodes 51, 52 which are connected, respectively, with the electrode layers 31, 32 through conductors filled in through holes 61, 62. Furthermore, buffer layers 71, 72 are provided, respectively, between the glass ceramic composite boards 41, 42 and the electrode layers 31, 32. Since the glass component is substantially blocked by the buffer layers 71, 72, decomposition of a lead based perovskite compound is retarded and high permittivity is achieved.</p> |
