Method for implanting a micro-circuit on a smart and/or memory card body, and card comprising a micro circuit thus implanted

摘要

The micro-circuit is implanted on an intelligent card and/or memory in thermoplastic material and involves heating the body of the card (3) at least in the implantation zone (8) destined to receive the micro-circuit (2). The micro-circuit is then pressed against the soft thermoplastic material to push it into the material, which is then cooled to hold the micro-circuit. A heated point is pressed on the surface and has an active area larger than that of the micro-circuit. There is a conduction field between the top and bottom parts of the card. On the top face of the card a conducting glue can be used to hold the micro-circuit.