发明名称 |
Device for conditioning polishing pads |
摘要 |
A device for conditioning the surface of a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element carrying cutting means on its bottom surface and which is adapted for vertical movement into and out of engagement with the surface of a polishing pad and which is adapted for oscillating horizontal movement over the surface of the polishing pad. The cutting means are dispersed in a circular or ring configuration.
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申请公布号 |
US5486131(A) |
申请公布日期 |
1996.01.23 |
申请号 |
US19940177156 |
申请日期 |
1994.01.04 |
申请人 |
SPEEDFAM CORPORATION |
发明人 |
CESNA, JOSEPH V.;VAN WOERKOM, ANTHONY G. |
分类号 |
B24B37/00;B24B37/04;B24B53/10;(IPC1-7):B24B1/00 |
主分类号 |
B24B37/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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