发明名称 METHOD OF SEPARATING IC PACKAGE BODY AND CUTTING DIE OF SEPARATOR
摘要 PURPOSE:To provide a method for separating linked package bodies into individual ones by which linked package bodies can be separated into individual ones without crack in the package bodies themselves and which can be applied to various other sizes of package bodies and different pitches between package bodies. CONSTITUTION:A resin member 11 between lead frame package bodies 10 of a multi-lead frame sheet is held and one lead frame 10 is pushed up by a push-up pin 6 and is inclined to make a crack in the resin member 11. After that, the resin member 11 is broken by a punch 9 and then is cut away. Even if the size or a pitch of the package bodies 10 changes, only one type of apparatus can manage such a change only if a set position of the punch 9 is changed.
申请公布号 JPH088276(A) 申请公布日期 1996.01.12
申请号 JP19940141419 申请日期 1994.06.23
申请人 NEC YAMAGATA LTD 发明人 DESUMONDO TEI
分类号 H01L21/56;B29C37/02;B29L31/34;(IPC1-7):H01L21/56 主分类号 H01L21/56
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