SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF

摘要

a lower wiring layer formed on a semiconductor substrate; the first interlayer insulating film formed for enveloping the lower wiring layer; the contact part formed on the first interlayer insulating film to expose the part of the lower wiring layer; an upper wiring layer connecting tungsten silycide layer with the contact pad by connecting the lower wiring layer through the first contact part .