| 摘要 |
<p>PURPOSE:To improve the electric characteristics while enhancing the the radiating effect by a method wherein insulating layers are formed of an electrodepositing resin on a metallic substrate so that a plurality of semiconductor chips may be mounted on a semiconductor chip mounting substrate comprising outer connecting terminal leads connected to the terminals of the wiring circuit layer on the insulating layer. CONSTITUTION:An insulating layer 4 is formed by electrodepositing a resin on the surface of a metallic substrate 1. Next, a wiring circuit board comprising a wiring circuit layer 7 is formed through the intermediary of the insulating layer 4. Next, a semiconductor chip mounting substrate comprising a lead 6 as an outer connecting terminal electrically connecting to the terminal of this wiring circuit layer 7 is formed. Next, a plurality of semiconductor chips 5 are mounted on this semiconductor chip mounting substrate 1. Through these procedures, the electric characteristics can be improved by using the metallic substrate 1 as a ground layer. On the other hand, the radiating effect can be enhanced by providing recessions in the metallic substrate 1 to be brought into contact with the sides of the semiconductor chips 5.</p> |
