RESIN SEALED MOLDING METHOD OF ELECTRONIC PART

摘要

PURPOSE:To quickly feed a lead frame preheated to a required temperature to a molding die cavity at a prescribed position in a resin sealing.molding device without setting a resin molding time long as a whole. CONSTITUTION:Two or more sets of molding units 5 each equipped with a preheating means 33 adjacent to a molding die cavity and a set of loader units 6 are provided. Lead frames 13 are transferred to the preheating means 33 of the molding units 5 respectively by the loader units 6 and preheated to a required temperature in a standby time for their transfer to molding die cavities. Furthermore, a resin tablet and the lead frame 13 subjected to a preheating process are quickly transferred to a prescribed position in a molding die cavity at the same time.