REMOVING SOLUTION FOR RESIDUE OF RESIST AFTER REMOVAL ON POLYIMIDE RESIN FILM AND PRODUCTION OF PATTERN OF POLYIMIDE RESIN FILM

摘要

PURPOSE:To obtain a removing soln. for removing residue of a resist after removal at the time of patterning polyimide resin by using a specified ether compd. as an essential component. CONSTITUTION:This removing soln. cont.ains an ether compd. represented by the formula R (O-CH2-CH2)nO-R<2> as an essential component. In the formula, each of R<1> and R<2> is H or 1-6C alkyl and (n) is an integer of 1-3. In a process for producing a polyimide resin pattern, a pattern part. 7 is formed in a prescribed part, an Al bonding pad part 8 is exposed and a positive resist layer 5 is removed by treating the substrate 1 with an org solvent. Residue 9 of the resist, on the surface of the resultant pattern of a polyimide resin film is removed by treating the substrate 1 with this removing soln. by dipping, showering, spraying or other method and the objective pattern of the polyimide resin film is obtd.