发明名称 |
Leadframe for making semiconductor devices |
摘要 |
A leadframe is provided for making semiconductor devices. The leadframe comprises at least one island arranged centrally widthwise of the leadframe and having four corner portions, four bridging legs radially extending from the respective corner portions of the island, the bridging legs being integral with the leadframe and island; and a multiplicity of leads radially extending toward but spaced from the island, the leads being integral with the leadframe. The leads have respective tips which are progessively closer to the island toward the respective bridging legs.
|
申请公布号 |
US5466968(A) |
申请公布日期 |
1995.11.14 |
申请号 |
US19940327835 |
申请日期 |
1994.11.01 |
申请人 |
ROHM CO. LTD. |
发明人 |
OKUMURA, HIROSHI;NEGORO, ATSUHITO |
分类号 |
H01L21/60;H01L23/495;H01L23/50;(IPC1-7):H01L23/48;H01L29/44;H01L29/52 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|